CH-HTE/高温高延伸率电解铜箔

通过对传统的原箔电镀工艺进行改良，生产出高温高延伸率电解铜箔，具有优良的常温与 高温性能，具有优良的高耐折特性，并且经过后处理后保留优良的结合力。/By improving the traditional original foil electroplating process, high temperature and high elongation electrolytic copper foil is produced, which has excellent properties at room temperature and high temperature, excellent folding resistance, and excellent adhesion after post-treatment.

• 适用于高密度互连技术板与柔性电路板/Suitable for HDI and FPC PCB.

产品/技术优势/Advantages of Product/ Technology

• 优异的高温延伸率/Excellent high temperature elongation
• 优良的高耐折特性/Excellent folding resistance
• 较低的粗糙度/Lower roughness
• 优良的基材结合力/Excellent substrate adhesion

产品/技术应用范围Application Area(s) of Product/ Technology

单面板、双面板、以及所有FR-4、CEM-1、CEM-3种类的基板/single-sided, double-sided PCB, and FR-4、CEM-1、CEM-3 substrate

代表特性数据/Representive date