CH-VLP/低轮廓铜箔

通过特殊的原箔生产工艺与后处理处理工艺，调整铜箔的微细结构，如晶粒大小、分布、 结晶位向及分布的状态，来降低铜箔轮廓度，降低PCB端产品应用中信损，拓展PCB端产品 应用领域。/The profile of copper foil can be reduced by adjusting the fine structure of copper foil, such as grain size, distribution, crystal orientation and distribution, through special raw foil production process and post- treatment process, so as to reduce the loss of PCB end products and expand the application field of PCB end products.
• 在铜箔与基板的交接接口上，不会在蚀刻后发生残留的铜粉(铜粉转移现象)，提高了 PCB 的表面电阻和层间电阻特性，提高了介电性能的可靠性。/At the interface between copper foil and substrate, there will be no residual copper powder (copper powder transfer phenomenon) after etching, which improves the surface resistance and interlayer resistance characteristics of and improves the reliability of dielectric properties.
• 在多层板压制成形后，较为平坦，适用于精线线路制作。/After the multilayer plate is pressed and formed, it is flat and suitable for fine line making.

产品/技术优势/Advantages of Product/ Technology

• 优良的热稳定性/Excellent thermal stability
• 高硬度，低轮廓度/High hardness, low profile
• 等轴结晶层特征，具有优良的常温与高温抗拉延伸/Characteristics of equiaxed crystalline layer with excellent tensile extension at room and high temperature
• PCB端信损小，特性阻抗控制优良/Small PCB end loss, Excellent characteristic impedance control

产品/技术应用范围Application Area(s) of Product/ Technology

5G通讯等电子信息产业发展高速印制电路板/5G Communications and Electroni9c Information Industry Development of High Speed Printed Circuit Boards

 代表特性数据/Representive date